Non-destructive testing of a high dense small dimension through silicon via (TSV) array structures by using 3D X-ray computed tomography method (CT scan).
| Autor: | Sekhar, V.N., Neo, S., Li Hong Yu, Trigg, A.D., Cheng Cheng Kuo |
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| Zdroj: | 2010 12th Electronics Packaging Technology Conference (EPTC); 2010, p462-466, 5p |
| Databáze: | Complementary Index |
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