Effects of overlayers on electromigration reliability improvement for Cu/low K interconnects.
| Autor: | Hu, C.-K., Canaperi, D., Chen, S.T., Gignac, L.M., Herbst, B., Kaldor, S., Krishnan, M., Liniger, E., Rath, D.L., Restaino, D., Rosenberg, R., Rubino, J., Seo, S.-C., Simon, A., Smith, S., Tseng, W.-T. |
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| Zdroj: | Proceedings of the 2004 IEEE International Reliability Physics Symposium; 2004, p222-228, 7p |
| Databáze: | Complementary Index |
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