High-density 3D packaging technology for CCD micro-camera system module.
| Autor: | Yamada, H., Togasaki, T., Kimura, M., Sudo, H. |
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| Zdroj: | Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090); 2001, p14-17, 4p |
| Databáze: | Complementary Index |
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