Process integration of Cu metallization and ultra low k (k=2.2).
| Autor: | Chuan-cheng Cheng, Wei-jen Hsia, Pallinti, J., Neumann, S., Koh, J., Li, P., Mei Zhu, Lu, M., Hao Cui, Fujimoto, T., Catabay, W., Wright, P. |
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| Zdroj: | Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519); 2002, p256-258, 3p |
| Databáze: | Complementary Index |
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