Towards a comparison between chip-level optical interconnection and board-level exterconnection.

Autor: Mule, A.V., Naeemi, A., Glytsis, E.N., Gaylord, T.K., Meindl, J.D.
Zdroj: Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519); 2002, p92-94, 3p
Databáze: Complementary Index