Flip chip power MOSFET: a new wafer scale packaging technique.
| Autor: | Arzumanyan, A., Sodhi, R., Kinzer, D., Schofield, H., Sammon, T. |
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| Zdroj: | Proceedings of the 13th International Symposium on Power Semiconductor Devices & ICs. IPSD '01 (IEEE Cat. No.01CH37216); 2001, p251-254, 4p |
| Databáze: | Complementary Index |
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