Fault isolation and failure analysis techniques for high density packaging.
| Autor: | Trigg, A.D. |
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| Zdroj: | Proceedings of the 11th International Symposium on the Physical & Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743); 2004, p93-98, 6p |
| Databáze: | Complementary Index |
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