Method for improved thermal performance of flip chip on flex power devices.
| Autor: | Vaccaro, B., Osenbach, J., Bachman, M., Amin, A., Crouthamel, D., Shilling, T., Thomas, E. |
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| Zdroj: | 2008 58th Electronic Components & Technology Conference; 2008, p1378-1384, 7p |
| Databáze: | Complementary Index |
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