Flip chip interconnects qualified for advanced low-k chips with SnCu bumps by alloying Cu/Sn plated stack.
| Autor: | Ezawa, H., Uchida, M., Miura, M., Togasaki, T., Iijima, T., Migita, T., Higuhci, K. |
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| Zdroj: | 2008 2nd Electronics System-Integration Technology Conference; 2008, p719-724, 6p |
| Databáze: | Complementary Index |
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