Development of Reliability Verification System for Robust Package Design.
| Autor: | Dongkil Shin, Hyunggil Baek, Joonyoung Oh, Dongok Kwak, Kuyoung Kim, Younghee Song, Jeongyeol Kim |
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| Zdroj: | 2007 International Conference on Thermal, Mechanical & Multi-Physics Simulation Experiments in Microelectronics & Micro-Systems. EuroSime 2007; 2007, p1-7, 7p |
| Databáze: | Complementary Index |
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