Die-level TSV fabrication platform for CMOS-MEMS integration.
| Autor: | Temiz, Y., Zervas, M., Guiducci, C., Leblebici, Y. |
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| Zdroj: | 2011 16th International Solid-State Sensors, Actuators & Microsystems Conference (TRANSDUCERS); 2011, p1799-1802, 4p |
| Databáze: | Complementary Index |
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