Out-of-plane assembly of 3D neural probe arrays using a platform with SU-8-based thermal actuators.
| Autor: | Herwik, S., Holzhammer, T., Paul, O., Ruther, P. |
|---|---|
| Zdroj: | 2011 16th International Solid-State Sensors, Actuators & Microsystems Conference (TRANSDUCERS); 2011, p2323-2326, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|