Mechanical characterisation of ultra-thin chips.
| Autor: | Endler, S., Hoang, T., Angelopoulos, E.A., Rempp, H., Harendt, C., Burghart, J.N. |
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| Zdroj: | 2011 Semiconductor Conference Dresden (SCD); 2011, p1-4, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Endler, S., Hoang, T., Angelopoulos, E.A., Rempp, H., Harendt, C., Burghart, J.N. |
|---|---|
| Zdroj: | 2011 Semiconductor Conference Dresden (SCD); 2011, p1-4, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|