Pitfalls and solutions of replacing gold wire with palladium coated copper wire in IC wire bonding.
| Autor: | Lei-Jun Tang, Hong-Meng Ho, Wei Koh, Yue-Jia Zhang, Kay-Soon Goh, Chun-Shu Huang, Yung-Tsan Yu |
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| Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p1673-1678, 6p |
| Databáze: | Complementary Index |
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