Reliability of 20μm micro bump interconnects.
Autor: | Ha-Young You, Yoon-Soo Lee, Sang-Keun Lee, Ju-Seong Kang |
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Zdroj: | 2011 IEEE 61st Electronic Components & Technology Conference (ECTC); 2011, p608-611, 4p |
Databáze: | Complementary Index |
Externí odkaz: |