Modeling electromigration-induced stress evolution in confined metal lines.
| Autor: | Clement, J. J., Thompson, C. V. |
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| Zdroj: | Journal of Applied Physics; 7/15/1995, Vol. 78 Issue 2, p900, 5p, 1 Diagram, 1 Graph |
| Abstrakt: | Deals with a study which discussed the modeling of the electromigration-induced stress evolution in confined metal lines. Factor associated with the interconnect failure; Information on the process of electromigration; Status of metal lines in integrated circuits. |
| Databáze: | Complementary Index |
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