| Autor: |
Hong, Stella Q., Hong, Q. Z., Li, Jian, Mayer, J. W. |
| Předmět: |
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| Zdroj: |
Journal of Applied Physics; 4/15/1994, Vol. 75 Issue 8, p3959, 5p |
| Abstrakt: |
Focuses on a study which investigated the interdiffusion and reaction in copper (Cu)/platinum silicide (PtSi)/silicon (100) structures. Description of Cu behavior during annealing across the intermediate PtSi layer; Observations when the sample was prepared in situ without breaking vacuum; Discussion on Cu silicide formation. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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