High-density multilayer connection technology for MEMS and CMOS applications.
| Autor: | Bai, Seoung Jai, Fasching, Rainer J., Prinz, Fritz B. |
|---|---|
| Zdroj: | Proceedings of SPIE; Nov2003, Issue 1, p536-542, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Bai, Seoung Jai, Fasching, Rainer J., Prinz, Fritz B. |
|---|---|
| Zdroj: | Proceedings of SPIE; Nov2003, Issue 1, p536-542, 7p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|