Fully integrated low-power flip chip bonding of arrayed optoelectronic devices on SOS.
| Autor: | Reedy, Ronald E., Anthony, Hal, Kuznia, Charles, Pendelton, Mike, Cable, Jim, Richaud, Jean |
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| Zdroj: | Proceedings of SPIE; Nov2002, Issue 1, p298-303, 6p |
| Databáze: | Complementary Index |
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