| Autor: |
Hyunwon Moon, Juyoung Han, Seung-Il Choi, Dongjin Keum, Byeong-Ha Park |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Microwave Theory & Techniques; May2010 Part 2, Vol. 58 Issue 5, p1447-1455, 9p |
| Abstrakt: |
In this paper, a multiband wideband code-division multiple access/high-speed downlink packet access direct-conversion receiver to cover all six Third-Generation Partnership Project bands is implemented in a 0.13-µm CMOS process. To reduce the increase of chip size due to implementation of the multimode multiband RF transceiver integrated circuit, a new integrated inductor structure sharing an inner diameter, a proposed mixed-type dc offset correction circuit, and a stacked structure of metal-insulator-metal and MOS capacitors is proposed. These silicon area reducing techniques can decrease the chip size by up to 30%. The measured full-path receiver performance is a noise figure of >3 dB, third-order intermodulation intercept point of > -17 dBm, and second-order intermodulation intercept point of > +30 dBm for all six bands. Its current consumption, including a frequency synthesizer, is 45 mA at 2.8-V supply voltage. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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