| Autor: |
Pathumudy, Ramakrishna Devananda, Samuel, Augustine, Prabhu, K. Narayan |
| Předmět: |
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| Zdroj: |
Heat Transfer; Jul2024, Vol. 53 Issue 5, p2416-2437, 22p |
| Abstrakt: |
A novel approach to assess the thermal conformance between two metallic materials under transient conditions was proposed in the present investigation. Thermal conformance parameters (ƞ, ϴ, tg) were defined to quantify the contact condition between a metal–metal interface. To assess the effect of load and thermophysical properties of the sink and source materials on the degree of thermal conformance, a thermal conformance assessment parameter (TCAP) was proposed. Heat flux transients at the thermal interface was estimated by using an inverse heat conduction approach for various similar and dissimilar metallic surfaces in contact such as Cu─Cu, Al─Al, Al─Cu, and Cu─Al under both load and no load conditions. Commercially available silicone grease (SG) and thermal grease (CTG) were used as thermal interface materials (TIMs). The thermal conformance parameters increased with the increase in load for all the combinations of interfaces with and without TIMs. It was observed that, except for the copper–copper combination, thermal conformance parameters showed a linear relation with the TCAP. The enhancement in the heat transfer due to the application of load and TIM was validated by determining the maximum temperature difference (∆Tmax) across the interface. The experimental study revealed that the ∆Tmax decreases with the application of load and application of TIM leading to enhanced heat transfer. For the copper–copper combination, the thermal conformance depended solely on the load applied. Due to the lower thermal resistance offered by copper source/sink materials, the interfacial resistance between them becomes a dominant factor. The effect of TIM on heat absorbed by the sink was significant for the Cu/Cu interface. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
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