| Autor: |
Yu, Shaoliang, Ranno, Luigi, Du, Qingyang, Serna, Samuel, McDonough, Colin, Fahrenkopf, Nicholas, Gu, Tian, Hu, Juejun |
| Předmět: |
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| Zdroj: |
Laser & Photonics Reviews; Jun2023, Vol. 17 Issue 6, p1-8, 8p |
| Abstrakt: |
Efficient fiber‐to‐chip coupling has been a major hurdle to cost‐effective packaging and scalable interconnections of photonic integrated circuits. Conventional photonic packaging methods relying on edge or grating coupling are constrained by high insertion losses, limited bandwidth density, narrow band operation, and sensitivity to misalignment. This work presents a new fiber‐to‐chip coupling scheme based on free‐form reflective micro‐optics. A design approach which simplifies the high‐dimensional free‐form optimization problem to as few as two full‐wave simulations is implemented to empower computationally efficient design of high‐performance free‐form reflectors while capitalizing on the expanded geometric degrees of freedom. This work demonstrates fiber array coupling to waveguides taped out through a standard foundry shuttle run and backend integrated with 3‐D printed micro‐optics. A low coupling loss down to 0.5 dB is experimentally measured at 1550 nm wavelength with a record 1‐dB bandwidth of 300 nm spanning O to U bands. The coupling scheme further affords large alignment tolerance, high bandwidth density, and solder reflow compatibility, qualifying it as a promising optical packaging solution for applications such as wavelength division multiplexing communications, broadband spectroscopic sensing, and nonlinear optical signal processing. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
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