| Autor: |
Virey, Eric H., Bouhamri, Zine |
| Předmět: |
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| Zdroj: |
SID Symposium Digest of Technical Papers; Jun2022, Vol. 53 Issue 1, p650-653, 4p |
| Abstrakt: |
For MicroLED displays to be economically viable, microchip transfer and assembly technologies with micron‐scale accuracy, and throughputs at least 5 orders of magnitude higher than traditional pick‐and‐place and bonding equipment are required. This paper discusses existing and emerging technologies, from the lab to commercially available solution. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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