Characterization of Chemical Bonding in Low-K Dielectric Materials for Interconnect Isolation: A XAS and EELS Study.

Autor: Hoffmann, Patrick, Schmeisser, Dieter, Engelmann, Hans-Juergen, Zschech, Ehrenfried, Stegmann, Heiko, Himpsel, Franz, Denlinger, Jonathan
Zdroj: MRS Online Proceedings Library; 2006, Vol. 914 Issue 1, p1-7, 7p
Databáze: Complementary Index
Externí odkaz: