Measurement and simulation of moisture induced die stresses in Quad Flat Packages.
| Autor: | Nguyen, Quang, Roberts, Jordan C., Suhling, Jeffrey C., Jaeger, Richard C. |
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| Zdroj: | 2016 15th IEEE Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2016, p1537-1545, 9p |
| Databáze: | Complementary Index |
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