Robust and reliable encapsulation of electronics for underwater applications.
| Autor: | Schwerz, R., Roellig, M., Frankenstein, B. |
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| Zdroj: | 2016 17th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2016, p1-6, 6p |
| Databáze: | Complementary Index |
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