High performance passive devices for millimeter wave system integration on integrated fan-out (InFO) wafer level packaging technology.
| Autor: | Tsai, Chung-Hao, Hsieh, Jeng-Shien, Lin, Wei-Heng, Yen, Liang-Ju, Hung, Jeng-Nan, Peng, Tai-Hao, Wang, Hsi-Ching, Kuo, Cheng-Yu, Huang, Issac, Chu, Welling, Lei, Yi-Yang, Yu, C. H., Sheu, Lawrence C., Hsieh, Ching-Hua, Liu, C. S., Yee, Kuo-Chung, Wang, Chuei-Tang, Yu, Doug |
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| Zdroj: | 2015 IEEE International Electron Devices Meeting (IEDM); 1/1/2015, p1.4-25.2.4, 0p |
| Databáze: | Complementary Index |
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