Combining organic and printed electronics in Hybrid System in Foil (HySiF) based smart skin for robotic applications.
Autor: | Hassan, Mahadi-Ul, Keck, Jurgen, Klauk, Hagen, Kostelnik, Jan, Mahsereci, Yigit, Sailer, Stefan, Schreivogel, Alina, Zaki, Tarek, Burghartz, Joachim N. |
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Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-6, 6p |
Databáze: | Complementary Index |
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