Combining organic and printed electronics in Hybrid System in Foil (HySiF) based smart skin for robotic applications.

Autor: Hassan, Mahadi-Ul, Keck, Jurgen, Klauk, Hagen, Kostelnik, Jan, Mahsereci, Yigit, Sailer, Stefan, Schreivogel, Alina, Zaki, Tarek, Burghartz, Joachim N.
Zdroj: 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-6, 6p
Databáze: Complementary Index