System I/O optimization with SoC, SiP, PCB co-design.
| Autor: | Mandavia, Humair, Koga, Kazunari, Bruning, Ralf, Kontic, Nikola |
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| Zdroj: | 2015 European Microelectronics Packaging Conference (EMPC); 2015, p1-4, 4p |
| Databáze: | Complementary Index |
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