Cobalt UBM for fine pitch microbump applications in 3DIC.

Autor: Derakhshandeh, Jaber, De Preter, Inge, Vandersmissen, Kevin, Dictus, Dries, Di Piazza, Luca, Hou, Lin, Guerrieri, Stefano, Vakanas, George, Armini, Silvia, Daily, Robert, Lesniewska, Alicja, Vandelaer, Yannick, Van De Peer, Myriam, Slabbekoorn, John, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric
Zdroj: 2015 IEEE International Interconnect Technology Conference & 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM); 2015, p221-224, 4p
Databáze: Complementary Index