Autor: |
Lin, Kevin L., Bielefeld, Jeffrey, Chawla, Jasmeet S., Carver, Colin T., Chebiam, Ramanan, Clarke, James S., Faber, Jacob, Harmes, Michael, Indukuri, Tejaswi, Jezewski, Christopher, Kasim, Rahim, Kobrinsky, Mauro, Kabir, Nafees A., Krist, Brian, Lakamraju, Narendra, Lang, Hazel, Mays, Ebony, Myers, Alan M., Plombon, John J., Singh, Kanwal Jit |
Zdroj: |
2015 IEEE International Interconnect Technology Conference & 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM); 2015, p139-142, 4p |
Databáze: |
Complementary Index |
Externí odkaz: |
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