Power QFN device bump ball lift issue study.

Autor: Zhang, Hanmin, Hu, M., Li, Ting, Yin, B.G, He, Q.C, Ye, D.H
Zdroj: 2015 16th International Conference on Electronic Packaging Technology (ICEPT); 2015, p1452-1455, 4p
Databáze: Complementary Index