| Autor: |
Zhou B; School of Electronics and Information Engineering, Shenzhen University, Shenzhen 518060, China., Fang F; School of Electronics and Information Engineering, Shenzhen University, Shenzhen 518060, China., Liu Z; International Collaborative Laboratory of 2D Materials for Optoelectronics Science and Technology of Ministry of Education, Institute of Microscale Optoelectronics, Shenzhen University, Shenzhen 518060, China., Zhong H; International Collaborative Laboratory of 2D Materials for Optoelectronics Science and Technology of Ministry of Education, Institute of Microscale Optoelectronics, Shenzhen University, Shenzhen 518060, China., Zhou K; Hoffmann Institute of Advanced Materials, Postdoctoral Innovation Practice Base, Shenzhen Polytechnic, Nanshan District, Shenzhen 518055, China., Hu H; Hoffmann Institute of Advanced Materials, Postdoctoral Innovation Practice Base, Shenzhen Polytechnic, Nanshan District, Shenzhen 518055, China., Min J; Department of Mechanical Engineering, University of Hong Kong, Hong Kong, Hong Kong., Zheng F; Department of Mechanical Engineering, University of Hong Kong, Hong Kong, Hong Kong., Fang S; Shandong Laboratory of Yantai Advanced Materials and Green Manufacturing, Yantai 264003, China., Nie J; International Collaborative Laboratory of 2D Materials for Optoelectronics Science and Technology of Ministry of Education, Institute of Microscale Optoelectronics, Shenzhen University, Shenzhen 518060, China., Huang JK; Department of Systems Engineering, City University of Hong Kong, Kowloon, Hong Kong., Li LJ; Department of Mechanical Engineering, University of Hong Kong, Hong Kong, Hong Kong., Li H; School of Electronics and Information Engineering, Shenzhen University, Shenzhen 518060, China., Wan Y; Department of Mechanical Engineering, University of Hong Kong, Hong Kong, Hong Kong., Shi Y; School of Electronics and Information Engineering, Shenzhen University, Shenzhen 518060, China. |
