Laser-Assisted Selective Fabrication of Copper Traces on Polymers by Electroplating.

Autor: Fiodorov V; Department of Laser Technologies, Center for Physical Sciences and Technology, Savanoriu Ave. 231, LT-02300 Vilnius, Lithuania., Ratautas K; Department of Laser Technologies, Center for Physical Sciences and Technology, Savanoriu Ave. 231, LT-02300 Vilnius, Lithuania., Mockus Z; Department of Chemical Engineering and Technology, Center for Physical Sciences and Technology, Sauletekio Ave. 3, LT-10257 Vilnius, Lithuania., Trusovas R; Department of Laser Technologies, Center for Physical Sciences and Technology, Savanoriu Ave. 231, LT-02300 Vilnius, Lithuania., Mikoliūnaitė L; Department of Organic Chemistry, Center for Physical Sciences and Technology, Sauletekio Ave. 3, LT-10257 Vilnius, Lithuania., Račiukaitis G; Department of Laser Technologies, Center for Physical Sciences and Technology, Savanoriu Ave. 231, LT-02300 Vilnius, Lithuania.
Jazyk: angličtina
Zdroj: Polymers [Polymers (Basel)] 2022 Feb 17; Vol. 14 (4). Date of Electronic Publication: 2022 Feb 17.
DOI: 10.3390/polym14040781
Abstrakt: The selective deposition of metals on dielectric materials is widely used in the electronic industry, making electro-conductive connections between circuit elements. We report a new low-cost laser-assisted method for the selective deposition of copper tracks on polymer surfaces by electroplating. The technique uses a laser for the selective modification of the polymer surface. The electrical conductivity of some polymers could be increased due to laser irradiation. Polyimide samples were treated using nanosecond and picosecond lasers working at a 1064 nm wavelength. An electro-conductive graphene-like layer was formed on the polymer surface after the laser treatment with selected parameters, and the copper layer thickness of 5-20 µm was deposited on the modified surface by electroplating. The selective laser-assisted electroplating technology allows the fabrication of copper tracks on complex shape dielectric materials. The technology could be used in the manufacturing of molded interconnect devices (MID).
Databáze: MEDLINE
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