A Statistical Analysis of Cooper Bottom Coverage of High-Aspect-Ratio Features Using Ionized Physical Vapor Deposition.
Autor: | Snodgrass, T.G., Shohet, J.L. |
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Zdroj: | IEEE Transactions on Semiconductor Manufacturing. Feb2002, Vol. 15 Issue 1, p30. 9p. 1 Black and White Photograph, 3 Diagrams, 1 Chart, 6 Graphs. |
Databáze: | Business Source Ultimate |
Externí odkaz: |