A Statistical Analysis of Cooper Bottom Coverage of High-Aspect-Ratio Features Using Ionized Physical Vapor Deposition.

Autor: Snodgrass, T.G., Shohet, J.L.
Zdroj: IEEE Transactions on Semiconductor Manufacturing. Feb2002, Vol. 15 Issue 1, p30. 9p. 1 Black and White Photograph, 3 Diagrams, 1 Chart, 6 Graphs.
Databáze: Business Source Ultimate