Prediction of Losses Caused by Roughness of Metallization in Printed-Circuit Boards.
| Autor: | Deutsch, Alina1 deutsch@ieee.org, Surovic, Christopher W.1 csurovic@us.ibm.com, Krabbenhoft, Roger S.2 rkrabben@us.ibm.com, Kopcsay, Gerard V.1 kopcsay@us.ibm.com, Chamberlin, Bruce J.3 chamberb@us.ibm.com |
|---|---|
| Zdroj: | IEEE Transactions on Advanced Packaging. May2007, Vol. 30 Issue 2, p279-287. 9p. |
| Databáze: | Business Source Ultimate |
| Externí odkaz: |
|