Copper wire interconnect reliability evaluation using in-situ High Temperature Storage Life (HTSL) tests.
| Autor: | Mavinkurve, A.1 amar.mavinkurve@nxp.com, Goumans, L.1, O’Halloran, G.M.1, Rongen, R.T.H.1, Farrugia, M.-L.1 |
|---|---|
| Zdroj: | Microelectronics Reliability. Sep2014, Vol. 54 Issue 9/10, p1661-1665. 5p. |
| Databáze: | Academic Search Ultimate |
| Externí odkaz: |
|
Full Text from ScienceDirect