Influence of electric field, liquid film thickness, and sodium chloride deposition on atmospheric corrosion of Cu.
Autor: | Rongdie Zhu1, Jinyang Zhu1 zhujinyang@ustb.edu.cn, Hongbin Zhang2 hongbinzh2008@aliyun.com, Binxia Ma1, Shaofeng Zhang2 |
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Zdroj: | International Journal of Electrochemical Science. Aug2024, Vol. 19 Issue 8, p1-8. 8p. |
Databáze: | Academic Search Ultimate |
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