Multi‐physics field coupling modeling and simulation to study the stress evolution during HTCLS curing process.
Autor: | Li, Haiying1 (AUTHOR), Cao, Zheng1,2 (AUTHOR), Li, Shujian1 (AUTHOR) smart0110@126.com, Chen, Yizhe3 (AUTHOR), Wang, Zhineng1 (AUTHOR), Wang, Xiaochuan4 (AUTHOR) |
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Zdroj: | Polymer Composites. 9/10/2024, Vol. 45 Issue 13, p11591-11604. 14p. |
Databáze: | Academic Search Ultimate |
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