Multi‐physics field coupling modeling and simulation to study the stress evolution during HTCLS curing process.

Autor:	Li, Haiying1 (AUTHOR), Cao, Zheng1,2 (AUTHOR), Li, Shujian1 (AUTHOR) smart0110@126.com, Chen, Yizhe3 (AUTHOR), Wang, Zhineng1 (AUTHOR), Wang, Xiaochuan4 (AUTHOR)
Zdroj:	Polymer Composites. 9/10/2024, Vol. 45 Issue 13, p11591-11604. 14p.
Databáze:	Academic Search Ultimate
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