Bonded Ceramic-Metal Layers for Fabrication of Thermal Conduction Plates.
| Autor: | Datta, Madhav1 madhavdatta@cb.amrita.edu |
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| Zdroj: | Journal of Microelectronic & Electronic Packaging. 2015 3rd Quarter, Vol. 12 Issue 3, p146-152. 7p. |
| Databáze: | Academic Search Ultimate |
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