Zobrazeno 1 - 10
of 3 561
pro vyhledávání: '"warpage"'
Autor:
Hu Zhen1 leslie.hu@jcetglobal.com, Zhao Wei1, Gu Xiao1, Chen Dong1, Chen Haijie1, Xu Hong1, Kim Hwee Tan1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2022, Vol. 19 Issue 3, p89-94. 6p.
MOLD DESIGN AND FLOW ANALYSIS FOR PRODUCT PROPELLER APC SF 11X4.7 WITH MINIMUM SHRINKAGE AND WARPAGE
Publikováno v:
Rekayasa Mesin, Vol 15, Iss 2, Pp 1041-1051 (2024)
Making molds in the injection molding manufacturing process is one of the basic steps that functions to prevent product defects during the production process. The product defects that most often occur in this manufacturing process include shrinkage a
Externí odkaz:
https://doaj.org/article/be26f4debcfd405d9e4cf4168b8f8d99
Publikováno v:
Materials & Design, Vol 245, Iss , Pp 113265- (2024)
Warpage in semiconductor packages is a critical issue that affects their reliability and performance. This study aims to minimize the warpage of a bi-material dummy package by optimizing the post-mold curing (PMC) temperature profile. A warpage simul
Externí odkaz:
https://doaj.org/article/0a43cc6d2e52476cbc2a4a0b203e0d8d
Autor:
Kwak, Jae B.1 jaekwak@chosun.ac.kr
Publikováno v:
International Journal of Advanced Manufacturing Technology. Feb2019, Vol. 100 Issue 9-12, p2803-2811. 9p.
Publikováno v:
Journal of Microelectronic & Electronic Packaging. Jan2019, Vol. 16 Issue 1, p13-20. 8p.
Publikováno v:
Frontiers in Materials, Vol 11 (2024)
Warpage deformation is a typical phenomenon for polymer injection-molded parts, mainly caused by unbalanced cooling, and it is inevitable. Complex process parameters usually lead to uncontrollable thermal behavior of the polymer materials during inje
Externí odkaz:
https://doaj.org/article/53de5ed34c764446b150a6da2619fc1e
Publikováno v:
Механика машин, механизмов и материалов, Iss 4(65), Pp 31-37 (2023)
The paper considers the main types and causes of surface damage that lead to the destruction and failure of large-sized bearings of motor-wheel reducers (MWR) of BELAZ mining dump trucks. The disadvantages of 20Х2Н4A (20Kh2N4A) steel currently used
Externí odkaz:
https://doaj.org/article/38c6c82bd1e64cffa2e6abc957b24b18
Autor:
Yasin, Saiful Bahri Mohd1,2 sbmyasin@gmail.com, Mohd, Nur Fatiah1, Mahmud, Jamaluddin2, Whashilah, Nabihah Shaibol1, Razak, Zakaria3
Publikováno v:
International Journal of Advanced Manufacturing Technology. Oct2018, Vol. 98 Issue 9-12, p2531-2537. 7p. 7 Color Photographs, 3 Diagrams, 3 Charts, 1 Graph.
Autor:
Kang, Sungbum1, Ume, I. Charles2 charles.ume@me.gatech.edu
Publikováno v:
International Journal of Advanced Manufacturing Technology. Jun2018, Vol. 96 Issue 9-12, p3235-3249. 15p.
Autor:
Wenchao Tian, Dexin Li, Haojie Dang, Shiqian Liang, Yizheng Zhang, Xiaojun Zhang, Si Chen, Xiaochuan Yu
Publikováno v:
Micromachines, Vol 15, Iss 9, p 1087 (2024)
Chip bonding, an essential process in power semiconductor device packaging, commonly includes welding and nano-silver sintering. Currently, most of the research on chip bonding technology focuses on the thermal stress analysis of tin–lead solder an
Externí odkaz:
https://doaj.org/article/7b8aeab5e5f74907a328cd79ec819b66