Zobrazeno 1 - 10
of 5 703
pro vyhledávání: '"wafer level"'
Autor:
Fang, Yexing1 (AUTHOR), Wang, Taiyu1 (AUTHOR), Gu, Yue2 (AUTHOR) y.gu@yale.edu, Yang, Mingkun1 (AUTHOR), Li, Hong1 (AUTHOR), Shi, Sujun1 (AUTHOR), Zhao, Xiuchen1 (AUTHOR), Huo, Yongjun1 (AUTHOR) y.gu@yale.edu
Publikováno v:
Materials (1996-1944). Apr2024, Vol. 17 Issue 7, p1658. 17p.
Autor:
Li, Susan1 (AUTHOR) susan.li@infineon.com, Frame, John1 (AUTHOR), Madriaga-Berry, Edita1 (AUTHOR), Hulog, Jose1 (AUTHOR), Zhang, Ming1 (AUTHOR), Terada, Masako2 (AUTHOR), Gu, Allen2 (AUTHOR), Taraci, David2 (AUTHOR)
Publikováno v:
Journal of Failure Analysis & Prevention. Oct2024, Vol. 24 Issue 5, p2232-2239. 8p.
Autor:
Zhao, Xinran1 (AUTHOR) officebomb@163.com, Pang, Yingying1 (AUTHOR) Yingyingpang-CETC@126.com, Wang, Gang1 (AUTHOR) Wanggang-CETC@163.com, Xia, Chenhui1 (AUTHOR) Xiachh-CETC@126.com, Yuan, Yuan1 (AUTHOR) Yuanyuan-cetc@126.com, Wang, Chengqian1 (AUTHOR) Wangchq-cetc@126.com
Publikováno v:
Soldering & Surface Mount Technology. 2024, Vol. 36 Issue 2, p93-100. 8p.
Autor:
Chuang, Wan-Chun1 (AUTHOR) m103020101@student.nsysu.edu.tw, Huang, Yi1 (AUTHOR), Chen, Po-En1 (AUTHOR)
Publikováno v:
Materials (1996-1944). May2023, Vol. 16 Issue 9, p3482. 15p.
Autor:
Salunke, Ashish S.1 ashishshivajisalunke@my.unt.edu, Alptekin, John1, Akula, Kaushik1, Jayakumar, Subiksha1, Kumar, Shaurya1, Chyan, Oliver1
Publikováno v:
Journal of Microelectronic & Electronic Packaging. 2023, Vol. 20 Issue 1, p17-26. 10p.
Autor:
Chen, Zuohuan1 (AUTHOR) xmuchenzh@stu.xmu.edu.cn, Yu, Daquan1 (AUTHOR) yudaquan@xmu.edu.cn
Publikováno v:
Sensors (14248220). Aug2022, Vol. 22 Issue 15, p5760-N.PAG. 13p.
Autor:
Singh, Shailendra1 (AUTHOR), Giridhar, M S2 (AUTHOR) giri@leos.gov.in, Jambhalikar, Ashwini2 (AUTHOR), Pratheek, T K2 (AUTHOR), Akshaya2 (AUTHOR), Gogulapati, Supriya2 (AUTHOR), Sharma, Deepak Kumar2 (AUTHOR), John, Jiju2 (AUTHOR), Dhar, Jolly1 (AUTHOR), Rao, C V N1 (AUTHOR), Jyoti, Rajeev1 (AUTHOR), Bhalke, Sangam3 (AUTHOR)
Publikováno v:
Sādhanā: Academy Proceedings in Engineering Sciences. Jun2022, Vol. 47 Issue 2, p1-14. 14p.
Autor:
Su, Qing-Hua1 (AUTHOR) 0967356474shq@gmail.com, Chiang, Kuo-Ning1 (AUTHOR) knchiang@pme.nthu.edu.tw
Publikováno v:
Materials (1996-1944). Jun2022, Vol. 15 Issue 11, p3897-3897. 14p.
Autor:
Roshanghias, Ali1 (AUTHOR) ali.roshanghias@silicon-austria.com, Bardong, Jochen1 (AUTHOR), Binder, Alfred1 (AUTHOR)
Publikováno v:
Materials (1996-1944). Apr2022, Vol. 15 Issue 8, pN.PAG-N.PAG. 10p.
Autor:
Inoue, Fumihiro1 (AUTHOR) inoue-fumihiro-ty@ynu.ac.jp, Phommahaxay, Alain1 (AUTHOR), Gokita, Yohei2 (AUTHOR), Möller, Berthold2 (AUTHOR), Beyne, Eric1 (AUTHOR)
Publikováno v:
International Journal of Advanced Manufacturing Technology. Mar2022, Vol. 119 Issue 5/6, p3427-3435. 9p.