Zobrazeno 1 - 10
of 8 048
pro vyhledávání: '"wafer bonding"'
Autor:
Takeuchi, Kai1 (AUTHOR) kai.takeuchi@tohoku.ac.jp, Suga, Tadatomo2 (AUTHOR), Higurashi, Eiji1 (AUTHOR)
Publikováno v:
Scientific Reports. 1/13/2024, Vol. 14 Issue 1, p1-8. 8p.
Autor:
Zhang, Yuqian1 (AUTHOR), Sun, Changzheng1 (AUTHOR) czsun@tsinghua.edu.cn, Xiong, Bing1 (AUTHOR), Wang, Jian1 (AUTHOR), Hao, Zhibiao1 (AUTHOR), Wang, Lai1 (AUTHOR), Han, Yanjun1 (AUTHOR), Li, Hongtao1 (AUTHOR), Luo, Yi1 (AUTHOR)
Publikováno v:
Applied Physics Letters. 8/26/2024, Vol. 125 Issue 9, p1-7. 7p.
Autor:
Chen, Wan-Ting1,2 (AUTHOR) 202234052@mail.sdu.edu.cn, Liu, Li1 (AUTHOR) liulisddx@mail.sdu.edu.cn, Zhao, Jia1,2 (AUTHOR) zhaojia@sdu.edu.cn, Zhang, Chen1,2 (AUTHOR) zhaojia@sdu.edu.cn
Publikováno v:
Nanomaterials (2079-4991). Apr2024, Vol. 14 Issue 8, p709. 13p.
Autor:
Persson, B. N. J.1,2 (AUTHOR) b.persson@fz-juelich.de, Mate, C. Mathew3 (AUTHOR)
Publikováno v:
European Physical Journal B: Condensed Matter. Apr2024, Vol. 97 Issue 4, p1-13. 13p.
Autor:
Ye, Lezhi1 (AUTHOR) yelezhi@bjut.edu.cn, Song, Xuanjie1 (AUTHOR) songxj@emails.bjut.edu.cn, Yue, Chang1 (AUTHOR) 15833860441@163.com
Publikováno v:
Microelectronics International. 2024, Vol. 41 Issue 1, p32-40. 9p.
Autor:
Jeon, Yu‐Rim1, Seo, Donguk2, Lee, Yoonmyung2, Akinwande, Deji1 deji@ece.utexas.edu, Choi, Changhwan3 cchoi@hanyang.ac.kr
Publikováno v:
Advanced Science. 8/21/2024, Vol. 11 Issue 31, p1-10. 10p.
Autor:
Feng, Wei1 (AUTHOR) wei.feng@aist.go.jp, Shimamoto, Haruo1 (AUTHOR) haruo.shimamoto@aist.go.jp, Kawagoe, Tsuyoshi2 (AUTHOR) t.kawagoe@ultramemory.co.jp, Honma, Ichirou2 (AUTHOR) i.homma@ultramemory.co.jp, Yamasaki, Masato2 (AUTHOR) m.yamasaki@ultramemory.co.jp, Okutsu, Fumitake2 (AUTHOR) f.okutsu@ultramemory.co.jp, Masuda, Takatoshi2 (AUTHOR) t.masuda@ultramemory.co.jp, Kikuchi, Katsuya1 (AUTHOR) k-kikuchi@aist.go.jp
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. Aug2023, Vol. 36 Issue 3, p398-403. 6p.
Autor:
Zhang, Jay1 (AUTHOR) zhangjj@corning.com, Ng, Chee-Hau2 (AUTHOR) chee_hau_ng@umc.com, Kouassi, Sebastien3 (AUTHOR) skouassi@psemi.com
Publikováno v:
IEEE Transactions on Semiconductor Manufacturing. Aug2023, Vol. 36 Issue 3, p340-344. 5p.
Autor:
Gasparini, Francis M.1 (AUTHOR) fmg@buffalo.edu
Publikováno v:
Journal of Low Temperature Physics. Dec2021, Vol. 205 Issue 5/6, p183-199. 17p.
Autor:
Khan, Mansoor1 (AUTHOR) Mansoor.Khan@usn.no, Khan, Talha Masood2 (AUTHOR)
Publikováno v:
Microsystem Technologies. Dec2023, Vol. 29 Issue 12, p1729-1737. 9p.