Deep reactive ion etching of through silicon vias

Autor: Roozeboom, Fred, Blauw, Michiel A., Lamy, Yann, van Grunsven, Eric, Dekkers, Wouter, Verhoeven, Jan F., van den Heuvel, Eric F., van der Drift, Emile, Kessels, Erwin W.M.M., van de Sanden, Richard M.C.M., Garrou, P., Bower, C., Ramm, P.

Publikováno v: Handbook of 3D Integration
Handbook of 3D integration : technology and applications of 3D integrated circuits, 45-91
STARTPAGE=45;ENDPAGE=91;TITLE=Handbook of 3D integration : technology and applications of 3D integrated circuits

This chapter contains sections titled: • Introduction• DRIE Equipment and Characterization• DRIE Processing• Practical Solutions in Via Etching• Concluding Remarks• Appendix A: Glossary of Abbreviations• Appendix B: Examples of DRIE Rec

Externí odkaz: https://explore.openaire.eu/search/publication?articleId=doi_dedup___::3549660dcc088dfe89c90ffdc329d411
https://doi.org/10.1002/9783527623051.ch4