FE modeling of Cu wire bond process and reliability.

Autor: Yuan, C., Weltevreden, E., van dan Akker, P., Kregting, R., de Vreugd, J., Zhang, G.Q.

Publikováno v: 2011 12th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2011, p1/5-5/5-5/5, 1p