Zobrazeno 1 - 10
of 1 146
pro vyhledávání: '"van Hoof, C."'
Autor:
Pattyn, E., Thammasan, N., Lutin, E., Tourolle, D., Van Kraaij, A., Kosunen, I., De Raedt, W., Van Hoof, C.
Publikováno v:
In Computer Methods and Programs in Biomedicine December 2023 242
Autor:
Poglitsch, A., Waelkens, C., Geis, N., Feuchtgruber, H., Vandenbussche, B., Rodriguez, L., Krause, O., Renotte, E., van Hoof, C., Saraceno, P., Cepa, J., Kerschbaum, F., Agnese, P., Ali, B., Altieri, B., Andreani, P., Augueres, J. -L., Balog, Z., Barl, L., Bauer, O. H., Belbachir, N., Benedettini, M., Billot, N., Boulade, O., Bischof, H., Blommaert, J., Callut, E., Cara, C., Cerulli, R., Cesarsky, D., Contursi, A., Creten, Y., De Meester, W., Doublier, V., Doumayrou, E., Duband, L., Exter, K., Genzel, R., Gillis, J. -M., Grözinger, U., Henning, T., Herreros, J., Huygen, R., Inguscio, M., Jakob, G., Jamar, C., Jean, C., de Jong, J., Katterloher, R., Kiss, C., Klaas, U., Lemke, D., Lutz, D., Madden, S., Marquet, B., Martignac, J., Mazy, A., Merken, P., Montfort, F., Morbidelli, L., Müller, T., Nielbock, M., Okumura, K., Orfei, R., Ottensamer, R., Pezzuto, S., Popesso, P., Putzeys, J., Regibo, S., Reveret, V., Royer, P., Sauvage, M., Schreiber, J., Stegmaier, J., Schmitt, D., Schubert, J., Sturm, E., Thiel, M., Tofani, G., Vavrek, R., Wetzstein, M., Wieprecht, E., Wiezorrek, E.
The Photodetector Array Camera and Spectrometer (PACS) is one of the three science instruments on ESA's far infrared and submillimetre observatory. It employs two Ge:Ga photoconductor arrays (stressed and unstressed) with 16x25 pixels, each, and two
Externí odkaz:
http://arxiv.org/abs/1005.1487
Publikováno v:
Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
This paper presents a polycrystalline silicon germanium (poly-SiGe) thermopile specially designed for thermoelectric generators used on human body. Both the design of the single thermocouple and the arrangement of the thermocouple array have been des
Externí odkaz:
http://arxiv.org/abs/0802.3067
Publikováno v:
Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)
This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180 degrees C based on nickel plating and photoresist sacrificial layers. The advantages of thin film
Externí odkaz:
http://arxiv.org/abs/0711.3317
Publikováno v:
Philosophical Transactions: Mathematical, Physical and Engineering Sciences, 1996 Oct . 354(1717), 2447-2462.
Externí odkaz:
https://www.jstor.org/stable/54781
Publikováno v:
In Microelectronic Engineering 25 May 2014 120:251-256
Autor:
Pettine, J., Patrascu, M., Karabacak, D.M., Vandecasteele, M., Petrescu, V., Brongersma, S.H., Crego-Calama, M., Van Hoof, C.
Publikováno v:
In Sensors & Actuators: A. Physical 15 January 2013 189:496-503
Autor:
Santana, J., van den Hoven, R., van Liempd, C., Colin, M., Saillen, N., Zonta, D., Trapani, D., Torfs, T., Van Hoof, C.
Publikováno v:
In Sensors & Actuators: A. Physical December 2012 188:141-147
Publikováno v:
In Sensors & Actuators: A. Physical April 2012 177:23-29
Autor:
Belleville, M., Fanet, H., Fiorini, P., Nicole, P., Pelgrom, M.J.M., Piguet, C., Hahn, R., Van Hoof, C., Vullers, R., Tartagni, M., Cantatore, E.
Publikováno v:
In Microelectronics Journal November 2010 41(11):740-745