Zobrazeno 1 - 10
of 610
pro vyhledávání: '"van Elshocht, S."'
Autor:
Liu, Enlong, Swerts, J., Devolder, T., Couet, S., Mertens, S., Lin, T., Spampinato, V., Franquet, A., Conard, T., Van Elshocht, S., Furnemont, A., De Boeck, J., Kar, G.
Publikováno v:
Journal of Applied Physics 121, 043905 (2017)
[Co/Ni] multilayers with perpendicular magnetic anisotropy (PMA) have been researched and applied in various spintronic applications. Typically the seed layer material is studied to provide the desired face-centered cubic (\textit{fcc}) texture to th
Externí odkaz:
http://arxiv.org/abs/1701.07713
Autor:
Popovici, M., Redolfi, A., Aoulaiche, M., van den Berg, J.A., Douhard, B., Swerts, J., Bailey, P., Kaczer, B., Groven, B., Meersschaut, J., Conard, T., Moussa, A., Adelmann, C., Delabie, A., Fazan, P., Van Elshocht, S., Jurczak, M.
Publikováno v:
In Microelectronic Engineering 1 November 2015 147:108-112
Autor:
Antony Premkumar, P., Carbonell, L., Schaekers, M., Opsomer, K., Adelmann, C., Richard, O., Bender, H., Franquet, A., Meersschaut, J., Wen, L., Zsolt, T., Van Elshocht, S.
Publikováno v:
In Microelectronic Engineering 25 May 2014 120:246-250
Autor:
van den Berg, J.A., Reading, M.A., Bailey, P., Noakes, T.Q.C., Adelmann, C., Popovici, M., Tielens, H., Conard, T., de Gendt, S., van Elshocht, S.
Publikováno v:
In Applied Surface Science 15 September 2013 281:8-16
Publikováno v:
In Thin Solid Films 2 September 2013 542:8-13
Autor:
Verdonck, P., Delabie, A., Swerts, J., Farrell, L., Baklanov, M.R., Tielens, H., Van Besien, E., Witters, T., Nyns, L., Van Elshocht, S.
Publikováno v:
In Microelectronic Engineering June 2013 106:81-84
Autor:
Hardy, A., Van Elshocht, S., De Dobbelaere, C., Hadermann, J., Pourtois, G., De Gendt, S., Afanas’ev, V.V., Van Bael, M.K.
Publikováno v:
In Materials Research Bulletin March 2012 47(3):511-517
Autor:
Jinesh, K.B., Dam, V.A.T., Swerts, J., de Nooijer, C., van Elshocht, S., Brongersma, S.H., Crego-Calama, M.
Publikováno v:
In Sensors & Actuators: B. Chemical 2011 156(1):276-282
Publikováno v:
In Microelectronic Engineering 2011 88(7):1098-1100
Publikováno v:
In Microelectronic Engineering 2011 88(7):1557-1559