Zobrazeno 1 - 10
of 282
pro vyhledávání: '"thermal laser stimulation"'
Publikováno v:
Photonics, Vol 10, Iss 5, p 540 (2023)
Locating the fault position is a crucial part of the failure mechanism analysis of integrated circuits. This paper proposes a hard defect locating system based on Thermal Laser Stimulation (TLS) technology. The equation for laser-induced changes in t
Externí odkaz:
https://doaj.org/article/9856a9432e41451fa9530a848cffd5d8
Publikováno v:
Transactions on Cryptographic Hardware and Embedded Systems, Vol 2018, Iss 3 (2018)
Thermal laser stimulation (TLS) is a failure analysis technique, which can be deployed by an adversary to localize and read out stored secrets in the SRAM of a chip. To this date, a few proof-of-concept experiments based on TLS or similar approaches
Externí odkaz:
https://doaj.org/article/5f100a8d27914d6f847b31ff4267741c
Akademický článek
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Autor:
Heiko Lohrke, Jean-Pierre Seifert, Thilo Krachenfels, Enrico Dietz, Heinz-Wilhelm Hübers, Sven Frohmann
Publikováno v:
Journal of Hardware and Systems Security. 4:24-33
Recent attacks using thermal laser stimulation (TLS) have shown that it is possible to extract cryptographic keys from the battery-backed memory on state-of-the-art field-programmable gate arrays (FPGAs). However, the professional failure analysis mi
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::bcdf0422706b86ef4426fc61eeaf30d8
https://doi.org/10.1007/s41635-019-00083-9
https://doi.org/10.1007/s41635-019-00083-9
Publikováno v:
International Symposium for Testing and Failure Analysis.
This paper presents novel optical beam-based defect localization approaches for resistive and open failed wafer-towafer (W2W) bonding interconnects for 3-D integration. The use of an etch back process in combination with thermal laser stimulation (TL
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::ee453b78c3b2224a5f41e1bcad1e5369
https://doi.org/10.31399/asm.cp.istfa2020p0006
https://doi.org/10.31399/asm.cp.istfa2020p0006
Publikováno v:
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).
Contactless Fault isolation (CFI) techniques of Microelectronic Debug and Failure Analysis (FA) are developed for the identification of anomalies. If not only anomalies can be detected but also regular logical functionality, the contactless approach
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::63bc5bb67bf437daca43f2979dffdccc
https://doi.org/10.1109/ipfa49335.2020.9261000
https://doi.org/10.1109/ipfa49335.2020.9261000
Autor:
I. De Wolf, K. Croes, Frank Altmann, Michél Simon-Najasek, A. Beyreuther, N. Herfurth, Christian Boit, T. Nakamura, C. Wu
Publikováno v:
Microelectronics Reliability. 92:73-78
For the first time a non-invasive localisation of a soft breakdown (SBD) is shown. The localisation is completed on fully functional back end of line (BEOL) test structures. The test structures used, provided by the interuniversity microelectronics c
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_dedup___::60711bd76f181525455c3c48a3e5a591
https://doi.org/10.1016/j.microrel.2018.11.009
https://doi.org/10.1016/j.microrel.2018.11.009
Publikováno v:
IACR Transactions on Cryptographic Hardware and Embedded Systems. :573-595
Thermal laser stimulation (TLS) is a failure analysis technique, which can be deployed by an adversary to localize and read out stored secrets in the SRAM of a chip. To this date, a few proof-of-concept experiments based on TLS or similar approaches
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::d6304dad83c873abd56e86f883ab8f9f
https://doi.org/10.46586/tches.v2018.i3.573-595
https://doi.org/10.46586/tches.v2018.i3.573-595
Publikováno v:
Microelectronics Reliability. 126:114293
With the increasing complexity of circuits, it is difficult to carry out fault isolation in a short time. This is particularly true for mixed-signal circuits when using only standard fault isolation techniques (e.g. EMMI or TLS). It is often complica
Externí odkaz:
https://explore.openaire.eu/search/publication?articleId=doi_________::a0bcc29d71290a72fce7bece783cb785
https://doi.org/10.1016/j.microrel.2021.114293
https://doi.org/10.1016/j.microrel.2021.114293
Akademický článek
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