Zobrazeno 1 - 10
of 2 878
pro vyhledávání: '"system in package"'
Autor:
Zampolli, S. a, ⁎, Elmi, I. a, Bruschi, P. b, Ria, A. b, Magliocca, F. c, Vitelli, M. c, Piotto, M. b
Publikováno v:
In Sensors and Actuators: B. Chemical 1 February 2025 424
Publikováno v:
Construction Innovation, 2022, Vol. 23, Issue 5, pp. 939-960.
Externí odkaz:
http://www.emeraldinsight.com/doi/10.1108/CI-09-2021-0173
Autor:
Aziz Oukaira, Dhaou Said, Djallel Eddine Touati, Nader El-Zarif, Ahmad Hassan, Yvon Savaria, Ahmed Lakhssassi
Publikováno v:
IEEE Access, Vol 12, Pp 143842-143853 (2024)
One of the fast-growing electronic integration technologies in the modern high-density microelectronics industry is System-in-Package (SiP). It is expected to accelerate application development when reducing implementation risks with optimized codes.
Externí odkaz:
https://doaj.org/article/37eab19dca684dd3a58c5de1a0a5ec29
Autor:
Md Sami Ul Islam Sami, Tao Zhang, Amit Mazumder Shuvo, Md Saad Ul Haque, Paul E. Calzada, Kimia Zamiri Azar, Hadi Mardani Kamali, Fahim Rahman, Farimah Farahmandi, Mark Tehranipoor
Publikováno v:
IEEE Access, Vol 12, Pp 48081-48107 (2024)
The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified system-in-package (SiP) to overcome the slowdown in Moore’s Law and Dennard scaling and to resp
Externí odkaz:
https://doaj.org/article/e06012ab5b6e46eab6276bb8384472df
Autor:
Oukaira, Aziz a, ⁎, Said, Dhaou b, Mellal, Idir c, Ettahri, Ouafaa a, Zbitou, Jamal d, Lakhssassi, Ahmed a
Publikováno v:
In AEUE - International Journal of Electronics and Communications December 2023 172
Publikováno v:
In Microelectronics Reliability June 2023 145
Autor:
Tobias Chaloun, Susanne Brandl, Norbert Ambrosius, Kevin Krohnert, Holger Maune, Christian Waldschmidt
Publikováno v:
IEEE Journal of Microwaves, Vol 3, Iss 2, Pp 783-799 (2023)
Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems w
Externí odkaz:
https://doaj.org/article/feeea0e6ce36411c9a26dad6e545c739
Publikováno v:
In Microelectronics Reliability February 2023 141
Akademický článek
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Publikováno v:
In Microelectronics Journal November 2022 129